Cu/MoCu/Cu (CPC) is a composite material composed of layers of copper (Cu), molybdenum copper (MoCu), and copper (Cu), combining the excellent properties of each constituent material. The typical composition of the MoCu alloy is Mo70Cu30. The coefficient of thermal expansion (CTE) of the CPC alloy can be adjusted according to specific requirements.
Material Characteristics:
1.Excellent Electrical and Thermal Conductivity: Suitable for efficient thermal management and electrical connections.
2.High-Temperature Stability: Capable of maintaining stable performance in high-temperature environments.
3.Thermal Expansion Matching: The low thermal expansion coefficient of molybdenum copper helps reduce thermal stress.
4.Mechanical Strength: Provides necessary mechanical support and structural integrity.
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Product Properties:
Partial Grade Performance Indicators:
Grade |
Density |
Coefficient of thermal Expansion at 20℃(10-6/K) |
Thermal conductivity W/(M·K) |
||
1:4:1 |
g/cm3 |
In-plane |
Thru-thickness |
In-plane |
Thru-thickness |
9.4 |
7.2 |
9.0 |
340 |
300 |
|
Application:
1.Electronics and Semiconductors:
1)Heat Sinks and Spreaders: Utilizing the high thermal conductivity of copper and the low thermal expansion coefficient of molybdenum copper, these are used for thermal management in high-power electronic devices and semiconductors.
2)Packaging Materials: Used as packaging materials in integrated circuits and power modules to provide thermal management and mechanical support.
2.Aerospace:
1)Structural Materials: In high-temperature and high-pressure environments, the high-temperature stability and mechanical strength of molybdenum copper are used to manufacture structural components of aerospace equipment.
2)Thermal Components: Employed in efficient thermal management devices within aircraft and spacecraft, ensuring stable operation of equipment at high temperatures.
3.Power and Energy:
1)Electrodes and Contacts: Utilizing the high electrical conductivity of copper and the wear resistance of molybdenum copper, these are used to manufacture electrodes and contacts in power equipment, such as high-voltage switches and relays.
2)Power Electronic Devices: Used in high-power equipment and renewable energy systems as thermal management and electrical connection materials.
4.Communications and Radar Equipment:
1)Microwave Devices: Taking advantage of the material's high thermal conductivity and low thermal expansion coefficient, these are used for thermal management in microwave and RF devices.
2)Radar Systems: Used as thermal management and electrical connection materials in radar antennas and transmitters.
If you have any interest in our Cu/MoCu/Cu alloy or other molybdenum alloy products, please feel free to contact us by email: sales@chinatungsten.com,sales@xiamentungsten.com or by telephone:86 592 512 9696.